| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-working method/apparatus for efficiently working a wafer, by measuring a surface shape by an inter-atom force microscope, without having to clean the wafer polished by CMP and cleaning the wafer. SOLUTION: The inter-atom force microscope 23 measures a projecting and recessed profile on the surface of the wafer 28, where CMP work is terminated. Measurement information, measured by the inter-atom force microscope 23, is outputted to a judgment device 140 and the judgment device 140 judges the quality of the wafer 28, based on measurement information. The good wafer 28 is transferred to a spin cleaning device 144, is cleaned, is transferred to a spin drying device 146 and is dried. The dried wafer 28 is kept by a transfer robot 30 and is stored in the prescribed rack of an original cassette.
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