发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To planarize the surface of an element region by suppressing breaking into of bird's beak into the element region, when an isolation region is formed by dividing LOCOS method into two stages. SOLUTION: In the method for fabricating a semiconductor device, the isolation region forming region 4 of a substrate 1 is masked by a first antioxidation film (silicon nitride film 3) having a first opening 7 and then first field oxidation is carried out to form a first field oxide film 9. Subsequently, the first field oxide film 9 is masked by a second antioxidation film (silicon nitride film 20), having a second opening 22 of smaller width dimension than the first opening 7 and then a second field oxidation is carried out, to form a deep second field oxide film 15 locally in the center of the first field oxide film 9.
申请公布号 JP2002050681(A) 申请公布日期 2002.02.15
申请号 JP20000236213 申请日期 2000.08.03
申请人 NEC CORP 发明人 MATSUZAKI TOMOKAZU
分类号 H01L21/316;H01L21/32;H01L21/76;H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/316
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