发明名称 CUTTER WHEEL FOR FRAGILE SUBSTRATE
摘要 <p>PURPOSE: To reduce friction resistance occurred in the scribe of a cutter wheel for fragile substrate and occurs between a wheel side and a shaft, and a chip holder inner wall face, and to improve the performance of the cutter wheel. CONSTITUTION: The groove of prescribed length in the axial direction or a groove oblique to the axial direction or a spiral groove in an inner peripheral face is formed in the inner peripheral face of a shaft hole, through which a rotary shaft is inserted in the cutter wheel. Friction between the inner peripheral face of the shaft hole and the rotary shaft and friction between the inner wall of the chip holder and a cutter wheel side are reduced.</p>
申请公布号 KR20020012115(A) 申请公布日期 2002.02.15
申请号 KR20010032021 申请日期 2001.06.08
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 MAEKAWA KAZUYA;SOYAMA HIROSHI
分类号 B26D1/14;B28D1/22;B28D1/24;B28D5/00;C03B33/10;H01L21/301;H05K1/03;H05K3/00;(IPC1-7):B26D1/14 主分类号 B26D1/14
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