| 摘要 |
PROBLEM TO BE SOLVED: To provide a microetching agent for copper or a copper alloy improvded in adhesive properties with resin and free from brown or black precipitates even in the case copper or an copper alloy is continuously treated and to provide a microetching method using the same. SOLUTION: This microetching agent for copper or a copper alloy is composed of an aqueous solution containing the main agent composed of sulfuric acid and hydrogen peroxide and auxiliaries composed of phenyltetrazole and a chlorine ion source, and in the microetching method, the surface of copper or a copper alloy is brought into contact with the above microetching agent and is etched by 0.5 to 3μm, and the surface is roughened.
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