发明名称 FLOOR MATERIAL FOR WIRING AND FLOOR MATERIAL APPARATUS FOR WIRING
摘要 PROBLEM TO BE SOLVED: To provide a floor material for wiring, which can easily and simply house therein wiring equipment, etc., without hindering wiring. SOLUTION: The floor material for wiring is laid on a foundation floor surface in a manner being spaced a predetermined interval away from the adjacent floor material, so as to form a wiring pit 3 therebetween, and a housing space capable of housing the wiring equipment 6, etc., is formed below a top board in a manner communicating with the wiring pit. Further, a part of the floor material 2f is rendered rotatable without interfering with the adjacent floor material, in order to face the part toward a space above the floor.
申请公布号 JP2002047785(A) 申请公布日期 2002.02.15
申请号 JP20010184614 申请日期 2001.06.19
申请人 MIRAI IND CO LTD 发明人 SHIMIZU SHOHACHI
分类号 E04F15/024;(IPC1-7):E04F15/024 主分类号 E04F15/024
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