发明名称 METHOD AND SYSTEM FOR NITRIDING SUBSTRATE CONTAINING ALUMINUM METAL
摘要 PROBLEM TO BE SOLVED: To suppress the dispersion of the state of formation of a nitride film or to accelerate the formation of the nitride film in forming the nitride film on a substrate containing aluminum metal. SOLUTION: The substrate containing at least aluminum metal is heat treated in vacuum of <=10-3 Torr and then subjected, in succession to the heat treatment, to nitriding under heating in an atmosphere 5 containing at least nitrogen. During the nitriding under heating, porous bodies 3 and 4 through which gases A and B containing nitrogen atoms can be allowed to flow are brought into contact with the atmosphere 5.
申请公布号 JP2002047553(A) 申请公布日期 2002.02.15
申请号 JP20000230468 申请日期 2000.07.31
申请人 NGK INSULATORS LTD 发明人 WATANABE MORIMICHI;KAWASAKI SHINJI;ISHIKAWA TAKAHIRO
分类号 C23C8/24;(IPC1-7):C23C8/24 主分类号 C23C8/24
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