| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system with which a thin film can be deposited with high precision on the surface of a substrate without adversely affecting the substrate. SOLUTION: A mask transfer part 130 which rotates and vertically moves to pick up and move a mask 121 for preventing the deposition of thin film is provided inside a chamber 110. The mask is mounted on the substrate 11 immediately before sputtering by means of the mask transfer part, and the mask is removed from the substrate immediately after sputtering by means of the mask transfer part.
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