| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-type electronic component, consisting of a filling material with which the terminals on the end surfaces of the component are filled in recessed grooves, and a metal film covering the upper part of this filling materials, and to provide the manufacturing method of the electronic component. SOLUTION: A chip-type electronic component of a structure, having increase in the quality of a metal film is formed on the terminals on the end surfaces of the component, stabilization of the quality are contrived; a conductor film will not peel off from the electronic component and will not defectively adhere to the electronic component; the adhesion of the metal film formed on the terminal parts on the end surfaces is strong; and the quality of the metal film is increased and the quality is stabilized.
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