| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce manufacturing time and cost of an electronic device. SOLUTION: The electronic device comprises a single or a plurality of semiconductor chips, wiring connected to the semiconductor chip, and an input/output terminal to an external device that is connected to the wiring. Furthermore, the device is configured, such that these members are packaged in stages by a plurality of insulating resin layers; the semiconductor chip or wiring for connecting the semiconductor chip is provided between the plurality of insulating resin layers; a conducting via for connecting the semiconductor chip; and the wiring is provided on the insulating resin layer and no wiring board is provided. The electronic device is formed into an external shape, such as a cube, a sphere, and a cylinder.</p> |
