| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for surely mounting a semiconductor chip onto a flexible substrate with reliable, high quality. SOLUTION: A semiconductor chip 1 is mounted onto the flexible substrate 2 through following three steps. First, an adhesive 4 is applied onto a preset substrate site on the substrate 2 by a supply station 3. Then, a plurality of semiconductor chips 1 is arranged on a substrate site 5 by a mounting station 6. Finally, the adhesive 4 is cured by a curing station 7. At this time the substrate 2 is fixed onto a flat support surface 10 by vacuum, while the adhesive 4 is being cured.
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