| 摘要 |
PROBLEM TO BE SOLVED: To provide a high performance electroless plating method comprising a new plating process which does not use palladium as a catalyst for electroless plating at all for solving the problems relating to the unstability in the feed and the high cost of palladium. SOLUTION: This high performance electroless plating method in which electroless plating is applid on the surface of a nonconductive material with mixed hydroxide as a catalyst has a catalyst applying stage in which, in a colloidal solution containing the mixed hydroxide of nickel and copper, the mixed hydroxide is applied on the surface of a nonconductive material, a reducing stage in which the nonconductive material is charged to the inside of a solution containing a strong reducing agent, and reducing treatment for the mixed hydroxide is performed, a reducing solution cleaning stage in which the nonconductive material is dipped into a reducing solution containing a reducing agent same as that contained in an electroless plating bath, and the surface of the nonconductive material is cleaned with the reducing solution and a plating stage in which the nonconductive material is subjected to plating treatment in the electroless plating bath without being subjected to water washing.
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