PACKAGE FOR HIGH FREQUENCY, WIRING BOARD, AND HIGH- FREQUENCY MODULE

摘要

PROBLEM TO BE SOLVED: To provide a high-frequency module having a superior isolation characteristic, where packages, each housing a high-frequency element, are mounted on a wiring board. SOLUTION: A high-frequency module (A) is housed in a package (b) for high-frequency; the package (b) is provided on the surface of a wiring board (a), comprising a dielectric board and forming a circuitry layer 17 thereon for mounting high-frequency elements 2 to 6; and the package (b) is mounted onto the wiring board (a) by connecting the circuitry layer 17 to an input terminal 12a and an output terminal 12b to constitute the module (A). The module A is divided into a plurality of high-frequency blocks by a division boundary line L, which is so set as to cross between an input terminal 12a and an output terminal 12b of at least one package b1 for high-frequency packaged on the wiring board (a).