METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method by which a highly reliable wiring board on which wiring conductors can be kept in a state where the conductors are firmly stuck to a base layer can be manufactured. SOLUTION: The wiring board is manufactured through a step of sticking the base layer 2 composed of glass or a resin to the upper surface of a substrate 1, a step of printing conductive paste 4' containing a conductive material having a larger specific gravity than the glass or resin forming the base layer 2 has on the upper surface of the base layer 2 in a prescribed pattern, and a step of forming the wiring conductors 4 in a state where at least parts of conductors 4 are buried in the base layer 2 by causing the conductive material in the paste 4' to descend into the layer 2 by heating the paste 4' to a temperature higher than the softening point of the layer 2 for a prescribed period of time.