CONDUCTIVE PATH, METHOD FOR MANUFACTURING CIRCUIT COMPRISING PAD AND MICRO VIA, AND METHOD TO MANUFACTURING PRINTED CIRCUIT AND HIGHLY INTEGRATE MULTILAYER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method for quickly forming interconnection between a conductive path, a pad, and a micro via on the surface of an insulating body for manufacturing an integrated circuit, a printed circuit, and a highly integrated multilayer module. SOLUTION: Related to manufacturing of a circuit comprising a conductive path, a pad, and a micro via on the upper surface of an insulating body covering a metallized layer, or at a circuit level, there are provided (A) process for forming, at a wanted position, one or more micro vias by penetrating/drilling the insulating body without drilling an underlying metallized layer or circuit level; and (B) process for forming a metal conductive path, a pad, and a micro via by metallizing on the surface of the insulating body and the micro via using a selective protection means through sticking of a protective layer.