| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaving a semiconductor device with improved productivity by making constant the amount of cutter thrust-up for obtaining stable cleavage force, and successively cleaving from the end of a work. SOLUTION: The method for cleaving the semiconductor device by pressing a cutter 125 along a surface with a previously formed scribe groove on the formed work 131 of the semiconductor device as a start point has a process for applying a first sheet 103 to one surface of glass 102, and then covering the work 131 arranged on the first sheet 103 with a second sheet 104 for retention, and a process for cleaving the work 131 by pressing the cutter 125 from the side of the second sheet 104 along the scribe groove. |
