| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate of high connection reliability together with its manufacturing method by inspecting rationally according to the nature of a conductor such as a terminal at a reduced cost wither less number of inspection steps. SOLUTION: A substrate 1 comprises an inside wiring such as a via conductor 48 far inside an upper-side conductor formation surface 2, and a plurality of upper-side conductor 11 formed on the upper-side conductor formation surface 2. The upper-side conductor 11 comprises an independent pad 12 insulated from the inside wiring such as the via conductor 48, an upper-side first conductor such as an array-like connection pad 13, a disc-like pad 16 electrically continually to the via conductor 48, and an upper-side second conductor such as an array-like connection pad 17. After inspecting, for appearance, the independent pad 12 and the array-like connection pad 13, the remaining upper-side second conductor such as the disc-like pad 16 is electrically inspected by touching a probe P1 and the like. Thus, the number of required probes is reduced while the cost for a jig and the like for inspection as well as the number of electric inspections are reduced. |
