| 摘要 |
<p>This invention consits of a sputtering target used in carrying out a PVD coating process where the sputtering target is sputtered by bombardment with gas atoms and a layer consisting of several metallic elements is deposited onto a substrate, the sputtering target being a plate (2) made of a metal used for building up said layer, and with the other metals used for building up the layer bieng present at least partially in the form of plugs (1), which are inserted in holes in the plate (2), the shape of the free surfaces of the plugs (1) being selected in such a way that the sputtering rate for each metal used in sputtering process can be set according to the desired composition of the layer being applied.</p> |
