发明名称 Memory
摘要 Serial bus modules with unique multibit identifications that may be searched with multiple modules on a single bus. Modules may contain temperature history per integrated Arrhenius temperature dependent signal. Modules may be packaged as tokens or as two or three lead plastic plastic, also with the three lead packages further functionality as sensors or switches may be incorporated into the modules.
申请公布号 US2002018513(A1) 申请公布日期 2002.02.14
申请号 US20010827825 申请日期 2001.04.06
申请人 DALLAS SEMICONDUCTOR CORPORATION 发明人 CURRY STEPHEN M.;BOLAN MICHAEL L.;DEIERLING KEVIN E.;PAYNE WILLIAM LEE;KURKOWSKI HAL;DIAS DONALD R.;ZANDERS GARY V.;LEE ROBERT D.;LEHMANN GUENTER H.
分类号 G01K1/02;G01K3/10;G01K7/24;G06F1/00;G06F1/20;G06F3/023;G06F3/033;G06F3/038;G06F3/048;G06F21/00;G06K7/00;G06K19/07;G11C5/00;G11C5/06;G11C7/06;G11C7/24;G11C8/20;H01L23/58;(IPC1-7):G01K7/00;G01K7/01 主分类号 G01K1/02
代理机构 代理人
主权项
地址