Surface inspection apparatus

摘要

A surface inspection apparatus is constructed of an illumination unit for irradiating a wafer with illumination radiation for inspection, and a radiation receiving unit having a CCD imaging device for detecting an image of the wafer by converging regularly reflected radiation from the wafer. The wafer surface is inspected based on the image detected by the CCD imaging device. An incident angle i and a wavelength lambd of the use-for-inspection illumination radiation with which the illumination unit irradiates the wafer, are set to satisfy the following conditional formula: lambd/(sin i+1)<=p (1) where p is a pattern repetitive pitch.