| 摘要 |
<p>A heat-resistant fibrous paper which is formed mainly from short fibers made of a heat-resistant organic polymer, short fibers made of an unstretched or lowly stretched para-aromatic polyamide, and an organic resin binder and/or fibrids made of a heat-resistant organic polymer, wherein the amount of the short fibers is 45 to 97 wt.% based on the whole paper, the amount of the organic resin binder and/or the fibrids is 3 to 55 wt.%, and the organic resin binder has been cured and/or the short fibers of an unstretched or lowly stretched para-aromatic polyamide and the fibrids were partly softened and/or deformed and melted to make them serve as a binder. This heat-resistant fibrous paper is excellent in heat resistance, thermal dimensional stability, interlaminar peel strength, electrical insulating properties in a high-humidity atmosphere, etc. and can be satisfactorily impregnated with a resin despite its high bulk density. It is especially suitable for use as a substrate for electrical insulating materials or a substrate for layered products for electrical circuits.</p> |
