Lead frame, semiconductor device and manufacturing method therefor, circuit board and electronic equipment

摘要

To provide a highly reliable lead frame in spite of its structure in which a bottom surface of a die pad thereof is exposed, a semiconductor device and a method for manufacturing the same, a circuit board and electronic equipment, the semiconductor device includes a semiconductor chip 30, a die pad 14 having an end section formed with a thin portion 16 thinner than a central section 18 thereof, and a sealing material 42, wherein one surface of the thin portion 16 of the die pad 14 is formed to be coplanar with one surface of the central section 18, and the sealing material 42 leaves exposed the surfaces of the thin portion 16 and the central section 18 in the coplanar surface of the die pad 14, and seals the end section of the die pad 14.