| 摘要 |
A containing device (11) and method to hold and immobilize solde r spheres during storage and transport including a container portion (12) having an open top terminal end (15) and an opposing closed bottom terminal end (16) with at least one side wall (20) connecting each terminal end, a removably attachable lid (13) to seal the container portion (12) and a lid insert (14) for insertion into the container portion (12) to immobilize solder spheres contained therein. In one embodiment, the lid insert (14) is comprised of compressible material, such as a polymeric foam, whereby insertion of the lid insert (14) into the container portion (12) causes compression of the lid insert (14) substantially adjacent to the side wall (20) of the container portion (12), a bottom planar surface of the lid and an uppermost surface layer of solder spheres to completely fill any open or dead space within the containing device (11). The lid insert (14) forms a mechanical seal which immobilizes the solder spheres until the lid insert (14) is removed from the containing device (11). |
