| 摘要 |
A heat sink apparatus for heat dissipation for a CPU includes a fan, a heat sink module and a latch. The fan has at least one attachment hole. The heat sink module is mounted onto the CPU, and is itself a metal heat conduction column having, a plurality of arc-shaped cooling fins radiating from the edge of the metal heat conduction column and a plurality of mounting holes positioned at the ends of the arc-shaped cooling fins. In addition, each mounting hole corresponds to a respective attachment hole. The latch comprises at least a latch arm, a plurality of openings and at least one latch hole. The latch arm is secured to the flange at the side of the CPU socket. Each of the openings corresponds to a mounting hole on the arc-shaped cooling fins of the heat sink module and the attachment holes on the fan.
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