发明名称 Semiconductor device and method of fabricating thereof
摘要 To realize TFT enabling high-speed operation by fabricating a crystalline semiconductor film in which positions and sizes of crystal grains are controlled and using the crystalline semiconductor film in a channel forming region of TFT, a film thickness is stepped by providing a stepped difference in at least one layer of a matrix insulating film among a plurality of matrix insulating films having refractive indices different from each other. By irradiating laser beam from a rear face side of a substrate (or both sides of a surface side and the rear face side of the substrate), there is formed an effective intensity distribution of laser beam with regard to a semiconductor film and there is produced a temperature gradient in correspondence with a shape of the stepped difference and a distribution of the film thickness of the matrix insulating film in the semiconductor film. By utilizing thereof, a location of producing lateral growth and a direction thereof can be controlled to thereby enable to provide crystal grains having large particle sizes.
申请公布号 US2002017685(A1) 申请公布日期 2002.02.14
申请号 US20010847596 申请日期 2001.05.03
申请人 KASAHARA KENJI;KAWASAKI RITSUKO;OHTANI HISASHI 发明人 KASAHARA KENJI;KAWASAKI RITSUKO;OHTANI HISASHI
分类号 G02F1/1362;H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L27/12;(IPC1-7):H01L27/01 主分类号 G02F1/1362
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