| 发明名称 |
Integrated circuit dielectric and method |
| 摘要 |
A surface treatment for porous silica to enhance adhesion of overlying layers. Treatments include surface group substitution, pore collapse, and gap filling layer (520) which invades open surface pores (514) of xerogel (510).
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| 申请公布号 |
US2002017641(A1) |
申请公布日期 |
2002.02.14 |
| 申请号 |
US20010899743 |
申请日期 |
2001.07.05 |
| 申请人 |
LU JIONG-PING;JIN CHANGMING |
发明人 |
LU JIONG-PING;JIN CHANGMING |
| 分类号 |
H01L21/3105;H01L21/314;H01L21/316;H01L21/762;H01L21/768;H01L23/29;H01L23/522;H01L23/532;(IPC1-7):H01L47/00 |
主分类号 |
H01L21/3105 |
| 代理机构 |
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代理人 |
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| 主权项 |
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