发明名称 |
Plating apparatus and plating liquid removing method |
摘要 |
A plating apparatus and a plating liquid removing method removes a plating liquid remaining on the substrate-contacting portion or its vicinity of a substrate holding member. The plating apparatus comprising a head having a rotatable housing provided with a substrate holding member for holding a substrate, a plating process container, disposed below said head, for holding a plating liquid therein, and a plating liquid removing mechanism for removing a plating liquid remaining on a substrate-contacting portion or its vicinity at an inner circumferential edge of said substrate holding member.
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申请公布号 |
US2002017465(A1) |
申请公布日期 |
2002.02.14 |
申请号 |
US20010922680 |
申请日期 |
2001.08.07 |
申请人 |
SENDAI SATOSHI;TOMIOKA KENYA;TSUDA KATSUMI |
发明人 |
SENDAI SATOSHI;TOMIOKA KENYA;TSUDA KATSUMI |
分类号 |
C23C18/38;C25D7/12;C25D17/00;C25D21/00;H01L21/288;H01L21/768;(IPC1-7):C25D5/48 |
主分类号 |
C23C18/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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