发明名称 MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME
摘要 <p>A cleaning sheet (29) comprising a through-hole (29a) formed in a place corresponding to the cavity of a mold assembly, the corners of the outer periphery of the through-hole (29a) being formed with slits (29b) and a flow cavity cut (29c), the cleaning sheet being disposed between the first and second molds of the mold assembly to clean the interior of the mold assembly, intended to improve the cleaning efficiency for the mold assembly.</p>
申请公布号 WO2002011966(P1) 申请公布日期 2002.02.14
申请号 JP2001005547 申请日期 2001.06.28
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址