MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME

摘要

A cleaning sheet (29) comprising a through-hole (29a) formed in a place corresponding to the cavity of a mold assembly, the corners of the outer periphery of the through-hole (29a) being formed with slits (29b) and a flow cavity cut (29c), the cleaning sheet being disposed between the first and second molds of the mold assembly to clean the interior of the mold assembly, intended to improve the cleaning efficiency for the mold assembly.