HEAT SINK ASSEMBLY WITH EVENLY DISTRIBUTED COMPRESSION FORCE

摘要

A heat sink assembly (10) for removing heat from an electronic device (12) is disclosed. A socket (14) is mounted to a printed circuit board (16) that has a top surface and a bottom surface and holes (18) formed therethrough. A heat generating device (12) is installed in the socket (14). Alignment pins (22) of a backing plate (20) are installed through the holes (18) in the circuit board (16). A clasp plate (26), having slits, grasps the alignment pins (22). The clasp plate (26) further includes a female threaded bore (30) which is positioned over the heat generating device (12). A heat sink member (32), with heat dissipating members (36) and a male threaded shank (34) with a bottom contact surface is threaded into the female threaded bore (30) so that the bottom contact surface of the threaded shank (34) is maintained in flush thermal and tensioned communication with the heat generating surface of the heat generating device (12).