发明名称 |
Semiconductor package and method of manufacturing semiconductor package |
摘要 |
The lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, allowing the semiconductor to have a reduced temperature.
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申请公布号 |
US2002019078(A1) |
申请公布日期 |
2002.02.14 |
申请号 |
US20010814964 |
申请日期 |
2001.03.23 |
申请人 |
SAKAI YOSHINORI;NOBORI KAZUHIRO;ARISUE KAZUO |
发明人 |
SAKAI YOSHINORI;NOBORI KAZUHIRO;ARISUE KAZUO |
分类号 |
H01L23/29;H01L23/31;H01L23/433;H01L23/48;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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