HYDROXYPOLYAMIDES AND PHOTOSENSITIVE RESIN COMPOSITIONS CONTAINING THE SAME

摘要

A photosensitive composition comprising 100 parts by weight of a novel hydroxypolyamide of the general formula (I), 0 to 100 parts by weight of a photoactive component, and a solvent is applied on the surface of a semiconductor device, subjected to patterning, and then cured by heating to form a heat-resistant film such as a surface protective film or a layer-insulation film: (I) wherein X1 is an aromatic group; X2 and X3 are each an organic group; a and b are each a mole fraction and the sum of a and b is 100 mole %, a being 60.0 to 100 mole %; 0 to 50 % of all of D's are each a 1,2-naphthoquinonediazide-4-sulfonic ester residue or a 1,2-naphthoquinonediazide-5-sulfonic ester residue, and the remainder thereof are each hydrogen; and Z is an organic group, with the proviso that when the content of the photoactive component in the composition is 0 part by weight, not all of D's are hydrogen.