DIELECTRIC COMPOSITION FOR MANUFACTURING INSULATING STRUCTURES
摘要
The invention relates to a dielectric composition for manufacturing an insulating structure that comprises at least one dielectric resin. The composition consists of granules of a thermo-fixed polymer and a dielectric resin in a thermo-fixed polymer/dielectric resin ratio ranging from 2:1 to 20:1. This makes it possible for the composition to withstand voltages of at least 45 kV and to exhibit a resistance of at least 25 M OMEGA . The invention also relates to dielectric structures obtained from said composition, wherein dielectric rigidity of said structures can be enhanced by means of a dielectric resin coating.
申请公布号
WO0213203(A2)
申请公布日期
2002.02.14
申请号
WO2001MX00056
申请日期
2001.08.02
申请人
PAGAZA MELERO, GERARDO;MARTINEZ HERRERA, SATURNINO ENRIQUE;PAGAZA MELERO, VICTOR
发明人
PAGAZA MELERO, GERARDO;MARTINEZ HERRERA, SATURNINO ENRIQUE;PAGAZA MELERO, VICTOR