发明名称 Low-inductance circuit arrangement
摘要 The invention relates to a circuit with low parasitic inductances, reduced current flow paths, and reduced current-circumfusion. The circuit includes a ceramic substrate supporting mutually insulated metallic connection webs and a first and a second series-connected power switch. Each power switch includes a first and a second power transistor connected in parallel and DC and AC leads. The insulation layer separates the conduction webs from a supporting substrate and is effective to minimize any parasitic inductances in the circuit arrangement.
申请公布号 US2002018353(A1) 申请公布日期 2002.02.14
申请号 US20010919376 申请日期 2001.07.31
申请人 MOURICK PAUL 发明人 MOURICK PAUL
分类号 H01L29/78;H01L25/07;H01L27/04;H02M7/00;(IPC1-7):H02M7/537 主分类号 H01L29/78
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