| 发明名称 |
Method of and apparatus for making heat-sensitive stencil and heat-sensitive stencil material |
| 摘要 |
When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.
|
| 申请公布号 |
US2002018874(A1) |
申请公布日期 |
2002.02.14 |
| 申请号 |
US20010858464 |
申请日期 |
2001.05.17 |
| 申请人 |
NAKAMURA JUN;OHSHIMA KENJI |
发明人 |
NAKAMURA JUN;OHSHIMA KENJI |
| 分类号 |
B41C1/055;B32B3/24;B32B27/00;B41C1/14;B41N1/24;(IPC1-7):B32B3/10 |
主分类号 |
B41C1/055 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
