发明名称 |
Connecting devices and method for interconnecting circuit components |
摘要 |
An integrated circuit package having metallized contact pads is provided with electrically conducting devices permanently attached to each contact pad. The devices are flexed when so attached, and are aligned and assembled onto corresponding pads of a second electrical component (e.g., a printed circuit board) to provide electrical connection between the integrated circuit package and the second electrical component.
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申请公布号 |
US2002019153(A1) |
申请公布日期 |
2002.02.14 |
申请号 |
US20010978128 |
申请日期 |
2001.10.15 |
申请人 |
AUDET GERALD P.;GUERIN LUC;LANDREVILLE JEAN-LUC |
发明人 |
AUDET GERALD P.;GUERIN LUC;LANDREVILLE JEAN-LUC |
分类号 |
H01R4/48;H01L23/12;H01L23/498;H01L23/50;H01R12/00;H05K1/18;H05K3/32;H05K7/10;(IPC1-7):H01R12/00 |
主分类号 |
H01R4/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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