Inserts for making change kit or socket universal to ic packages of varying configuration and sizes

摘要

A change kit (100) for retaining integrated circuit packages (120) in an assembly process or test process of the packages (120). The change kit (100) comprises a substrate (102) having openings (104), and inserts (110) configured to be inserted into the respective openings (104). The inserts (110) are inserted into the respective openings (104) for changing a configuration and/or size of the respective openings (104) in accordance with a configuration and size of integrated circuit packages (120) to be retained by the change kit (100) so that the packages (120) are accommodated in the respective openings (104). This enables the change kit (100) to retain integrated circuit packages (120) of varying configurations and/or sizes.