| 摘要 |
A socket such as IC socket for an electrical part such as IC package is provided with a socket body having a mount portion on which an electrical part is mounted, a plurality of contact pins are disposed to the socket body so as to be contacted to or separated from terminals of the electrical part. A movable plate is disposed to the socket body to be movable, and when the movable plate is moved, contact portions of each of the contact pins are displaced so as to be contacted to or separated from the terminal of the electrical part. Each of the contact pins is formed with an elastic piece having an end portion to which the contact portions are formed, and the contact portions are contacted to a side surface portion of the terminal to thereby establish an electrical connection therebetween and the contact portions each is formed with an inclining surface inclining, in a plan view in a use of the socket, with respect to a direction normal to the displacement direction of the contact portion. <IMAGE> |
