发明名称 Process for preparing water-soluble package
摘要 <p>A process for producing a thermoformed package comprises the steps of placing a first sheet of film over a forming die having at least one cavity, heating the film to mould the film into the at least one cavity thereby forming at least one recess in the film, placing a composition in the at least one formed recess, and sealing a second sheet of film across the at least one formed recess to produce at least one closed package. Once formed, the or each recess is substantially retained in its formed orientation by the application of a vacuum through the or each cavity.</p>
申请公布号 CZ20013336(A3) 申请公布日期 2002.02.13
申请号 CZ20010003336 申请日期 2000.03.07
申请人 UNILEVER NV 发明人 HARBOUR RICHARD
分类号 B65B11/50;(IPC1-7):B65B11/50 主分类号 B65B11/50
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