| 摘要 |
<p>First and second parting plates (7,11) are arranged as a bottom plate and a top plate on resin outflow surfaces of the first and second printed wiring boards (1,2) upon carrying out the hole filling process, respectively. First and second hole guide (8,10) have, as guide holes (12,13,14,15) upon insertion of a hole filling resin (9), injection holes matching the through holes in the first and second printed wiring boards (1,2). The hole filling resin (9) comprises, for example, an epoxy resin.The hole filling resin (9) is required to have a thermosetting property. The stacked assembly is subjected to vacuum pressing (16) and heating. By heating, the hole filling resin (9) is melted and therefore has flowability. Under the influence of the vacuum pressing, the hole filling resin (9) having flowability passes through the guide holes (12,13,14,15) of the first and the second hole guide plates (8,10) to be injected into the through holes (3,4,5,6) of the first and the second printed wiring boards (1,2).The hole filling resin (9) is sufficiently filled in the through holes (3,4,5,6) as filled resins, (17,18,19,20). By further vacuum pressing and heating, the hole filling resin (9) is cured. The resultant integral assembly is removed from the press and the first and the second printed wiring boards (1,2) are separated. <IMAGE> <IMAGE></p> |
