发明名称 Robotic gripping device for gripping an object having a handle on an upper surface
摘要 A wafer pod handling device engages a pod for transport through a flange on top of the pod by receiving the flange into a receptacle and rotating a circular disk having a square aperture such that edges on the disk are positioned beneath an overhang on the flange. As the circular disk is lifted, the edges contact the overhang of the flange and lift the pod. The circular disk is mounted in a housing having a lip adapted to slideably engage the circumference of the circular disk. An actuator on top of the housing rotates the disk into engagement with the flange. As the housing is lifted, the circumference of the circular disk rests on the lip to frictionally secure and support the circular disk despite power failures or accidental rotation that could disengage the pod.
申请公布号 US6345851(B1) 申请公布日期 2002.02.12
申请号 US20000506138 申请日期 2000.02.17
申请人 PRI AUTOMATION, INC. 发明人 FRIEDMAN GERALD M.
分类号 B25J15/08;B65D85/86;B65G1/00;B66C1/62;B66C1/66;B66C1/68;H01L21/673;H01L21/687;(IPC1-7):B66C1/66 主分类号 B25J15/08
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