| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink type cooling device capable of enhancing its heat radiating effect without enlarging size of a fin to have high cooling capacity in small size. SOLUTION: In this heat sink type cooling device, having a passage 6 allowing a coolant to flow to be provided with a heat sink taking heat from electronic equipments 8 into contact with an upper surface 7 of the passage, a fin group 21 having a plurality of fins arranged in parallel to a flow of the coolant to be additionally lined up in a direction of thickness thereof is arranged in the passage 6, the fin of one fin group 21 is arranged by deviating a position in a direction of thickness of the fin relating to the fin of the fin group 21 adjacent to each other in a direction of the flow. |
