METHOD OF DRESSING POLISHING CLOTH FOR POLISHING WAFER

摘要

PROBLEM TO BE SOLVED: To adjust the polishing surface of polishing cloth used in the polishing of a wafer to provide a wafer excellent in dimensional accuracy by making dressing tools act as uniformly as possible in the radial direction of a surface plate. SOLUTION: A carrier 1, which incorporates a plurality of dressing tools 2 arranged so that the total times during which the dressing tools make contact with the polishing cloth in a wafer contact area D are equal in the radial direction of the surface plate, is used to achieve uniform action of the dressing tools 2 in the radial direction of the surface plate 3. The use of annular dressing tools or fan-shaped dressing tools with gears that mesh with the sun gear and internal gear of the polishing apparatus also achieves uniform action of the dressing tools in the radial direction of the surface plate.