发明名称 CUTTING DEVICE FOR GLASS PLATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a cutting device for glass plate, with which a glass plate is cut in an excellent condition with the emission of a CO2 laser beam. SOLUTION: A laser beam oscillator 18 is fixed on a frame 16 and the frame 16 is provided with an optical system unit 20 and a mirror unit 22 which are freely movable. A CPU controls each of servo motors 24 and 26 which moves the optical system unit 20 and the mirror unit 22, respectively, and also controls to keep the optical path from the emission port of the laser beam oscillator 18 to the machining position 13 of the glass plate 12 constant.</p>
申请公布号 JP2002045984(A) 申请公布日期 2002.02.12
申请号 JP20000239463 申请日期 2000.08.08
申请人 ASAHI GLASS CO LTD 发明人 MIYAWAKI TAKESHI
分类号 B23K26/00;B23K26/40;C03B33/027;C03B33/037;C03B33/09;(IPC1-7):B23K26/00 主分类号 B23K26/00
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