| 摘要 |
Resistance-reducing conductive adhesives, and apparatus and methods of attaching electronic components using resistance-reducing conductive adhesives are provided. In one embodiment, a resistance-reducing conductive adhesive includes a first quantity of conductive adhesive, and a second quantity of a chelating agent combined with the conductive adhesive. The chelating agent reacts with an oxidized conductive material (e.g. alumina or aluminum ion) on a conductive lead to form soluble conductive metal-ligand complex. The chelating agent may also passivate the oxide-free conductive material by forming hydrogen bonds. The resistance of the resulting electrical connection is reduced in comparison with prior art methods of conductive adhesive coupling, providing improved signal strength, reduced power consumption, and decreased waste heat. In alternate embodiments, the conductive adhesive may include an anisotropically conductive adhesive, an isotropically conductive adhesive, a conductive epoxy, or a hydrophilic adhesive. Similarly, the conductive material may include aluminum, copper, gold, nickel, platinum or silver. Alternately, the chelating agents may be any suitable agent that provides the desired reactive mechanisms, including, for example, an oxalic acid, malonic acid, succinic acid, or citric acid. In a further embodiment, the quantity of chelating agent is a value within the range from approximately 0.1 percent by weight to approximately 20 percent by weight, inclusive. In another embodiment, an electronic assembly includes a first component having a first conductive lead, a second conductive lead, and a resistance-reducing conductive layer extending between the first and second conductive leads. The first component may be a die, a circuit board, or any other electronic component.
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