| 发明名称 |
HEAT-CURABLE BISMALEIMIDE RESINS |
| 摘要 |
Heat-curable bismaleimide resins containing an aromatic alkenyl compound, prefer- ably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated tempera- tures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.
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| 申请公布号 |
CA2023666(C) |
申请公布日期 |
2002.02.12 |
| 申请号 |
CA19902023666 |
申请日期 |
1990.08.21 |
| 申请人 |
EISENBARTH, PHILIPP;PETER, ROLAND;FOLDA, THOMAS |
发明人 |
EISENBARTH, PHILIPP;PETER, ROLAND;FOLDA, THOMAS |
| 分类号 |
C08F222/40;C08G73/12;C08J5/24;C08L79/08;(IPC1-7):C08F222/40 |
主分类号 |
C08F222/40 |
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