发明名称 HEAT-RESISTANT RESIN COMPOSITION, COATING MATERIAL AND ENAMEL WIRE
摘要 PROBLEM TO BE SOLVED: To obtain a polyamideimide based heat-resistant resin composition having excellent wear resistance and flexibility, a coating material which uses this heat-resistant resin composition as the film-forming component, and an enamel wire having excellent wear resistance and flexibility which uses this coating material. SOLUTION: The heat-resistant resin composition comprises a polyamideimide resin and a heterocyclic mercaptan represented by formula (I) (wherein A is a group to form a 5 or 6-memebered hetero ring together with a group of formula (II) and has a main chain composed of two or three carbon atoms bonded by a single bond or a double bond, two or three carbon atoms forming a part of one aromatic ring, two nitrogen atoms bonded by a single bond or a double bond, or one carbon atom and one or two nitrogen atoms bonded by a single bond or a double bond; and X is oxygen atom, sulfur atom, carbon atom or nitrogen atom and the carbon atom or the nitrogen atom is substituted with hydrogen atom, a 1-4C alkyl group, phenyl group or mercapto group). The coating material and the enamel wire use this heat-resistant resin composition.
申请公布号 JP2002047414(A) 申请公布日期 2002.02.12
申请号 JP20000352344 申请日期 2000.11.20
申请人 HITACHI CHEM CO LTD 发明人 OKAWARA TOSHIICHI;OSADA YUICHI;YOTSUYA SEIICHI
分类号 C08L79/08;C08K5/37;C09D5/25;C09D179/08;H01B3/30;H01B7/02;(IPC1-7):C08L79/08 主分类号 C08L79/08
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