| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in a heat and water resistances of a molded article and giving electric laminated boards with a moisture and heat resistances and an adhesion property and to provide electrical laminated boards with a moisture and heat resistances. SOLUTION: The epoxy resin composition is characteristically composed of (A) an epoxy resin having a structural unit Ar-P- (Ar represents an aryl group.), of weight-average molecular weight 2000-50000 as a polystyrene as an essential component.
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