发明名称 MOLD FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a heating mold in which a design surface is heated by energizing metal plates for resistance heat generation, and an uniform temperature distribution is obtained and which can be subjected to quick heating/cooling which is not disadvantageous for cooling and inexpensive in terms of costs by using insulating layers high in heat conduction. SOLUTION: On a surface to be the design of a mold cavity 5 formed by a movable mold 1 and a fixed mold 4, the metal plates 2 for resistance heat generation are embedded in the insulating layers 3a and 3b formed by a thermosetting resin material in which metal powder and the resin are mixed, the insulating layer 3b is made the design surface of the mold cavity 5, the metal plate 2 is heated by energization. the design surface is heated by the heat of the metal plate 2. Since a molten resin can be cooled immediately after being injected into the mold cavity, the weld line, flow mark, transfer nonuniformity, etc., of a molding can hardly be generated, and a mold transfer property is improved.
申请公布号 JP2002046160(A) 申请公布日期 2002.02.12
申请号 JP20000233983 申请日期 2000.08.02
申请人 PACIFIC IND CO LTD 发明人 SHIMODA MASAYUKI
分类号 B29C45/73;B29C33/02;(IPC1-7):B29C45/73 主分类号 B29C45/73
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