发明名称 SEGMENTED STRUCTURE OF DIAMOND BLADE
摘要 PROBLEM TO BE SOLVED: To provide a segmented structure of a stable and sharp diamond blade without shortening its service life, in solving the problems of the initial sharpness and the grain replacement of a diamond blade product. SOLUTION: Grains approximately equal in diameter to diamond abrasives and having a Knoop hardness of 2500 Kg/mm2 or less at room temperature, made from a material with a melting point higher than a temperature for baking segment chips 2 mounted to the outer periphery of a disc-shaped stock 1, are buried in a cutting surface on the outer periphery of each diamond chip 2 up to a depth that is 1 to 3 times the grain diameter, as measured from the surface of the cutting surface. The ratio of the number of diamond abrasives to that of grains buried is from 2:1 to 1:4. The grains buried are geometrically arranged in this ratio on the outer peripheral surface of each segment chip.
申请公布号 JP2002046071(A) 申请公布日期 2002.02.12
申请号 JP20000232160 申请日期 2000.07.31
申请人 NORITAKE DIAMOND IND CO LTD;NORITAKE CO LTD 发明人 OGATA SEIYA
分类号 B24D5/12;B24D3/00;B24D5/06;(IPC1-7):B24D5/12 主分类号 B24D5/12
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