发明名称 Structure for mounting a PCB in an electronic apparatus housing
摘要 A structure for mounting a printed circuit board (PCB) in an electronic apparatus housing is disclosed. The structure comprises a plurality of holes, a plurality of bosses, and a plurality of seat members. The holes are formed in the printed circuit board. The bosses are formed on the upper surface of the bottom of the electronic apparatus housing at positions corresponding to the positions of the holes. Each of the seat members consists of a seat portion, a vertical cylinder portion and a flange. The seat portion serves to support the bottom surface of the head of a screw while being positioned on the top surface of each of the bosses, and has a center hole through which the screw passes. The vertical cylinder portion is extended from the circumferential end portion of the seat portion, defines a hollow portion in which the head of the screw is positioned, and is inserted into each of the holes of the main board. The flange serves to support the main board while being positioned on the top surface of each of the bosses, is horizontally extended from the circumferential edge of the screw seat, and is soldered to the lower surface of the main board.
申请公布号 US6347044(B1) 申请公布日期 2002.02.12
申请号 US20000591618 申请日期 2000.06.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 WON BUM-YOUNG;PARK BUM-SU
分类号 G06F1/16;H05K7/14;(IPC1-7):H05K7/04 主分类号 G06F1/16
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